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| 1 motorola sensor device data ! the mpx10 and mpxv10gc series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output e directly proportional to the applied pressure. these standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. compensation techniques are simplified because of the predictability of motorola's single element strain gauge design. figure 1 shows a schematic of the internal circuitry on the standalone pressure sensor chip. features ? low cost ? patented silicon shear stress strain gauge design ? ratiometric to supply voltage ? easy to use chip carrier package options ? differential and gauge options ? durable epoxy unibody element or thermoplastic (pps) surface mount package application examples ? air movement control ? environmental control systems ? level indicators ? leak detection ? medical instrumentation ? industrial controls ? pneumatic control systems ? robotics figure 1. uncompensated pressure sensor schematic % % & ( 132 ( 132 ( % voltage output versus applied differential pressure the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). order this document by mpx10/d semiconductor technical data ? motorola, inc. 2001 0 to 10 kpa (01.45 psi) 35 mv full scale span (typical) note: pin 1 is noted by the notch in the lead. pin number MPX10D case 344 MPX10Dp case 344c 1 2 gnd +v out 3 4 v s v out unibody package small outline package mpxv10gc6u case 482a mpxv10gc7u case 482c pin number 1 2 3 gnd +v out vs 5 6 7 n/c n/c n/c 4v out 8 n/c note: pin 1 is noted by the notch in the lead. rev 10 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa burst pressure (p1 > p2) p burst 100 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 3.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit differential pressure range (1) p op 0 e 10 kpa supply voltage (2) v s e 3.0 6.0 vdc supply current i o e 6.0 e madc full scale span (3) v fss 20 35 50 mv offset (4) v off 0 20 35 mv sensitivity d v/ d p e 3.5 e mv/kpa linearity (5) e 1.0 e 1.0 %v fss pressure hysteresis (5) (0 to 10 kpa) e e 0.1 e %v fss temperature hysteresis (5) (40 c to +125 c) e e 0.5 e %v fss temperature coefficient of full scale span (5) tcv fss 0.22 e 4 0.16 %v fss / c temperature coefficient of offset (5) tcv off e 15 e m v/ c temperature coefficient of resistance (5) tcr 0.28 e 0.34 %z in / c input impedance z in 400 e 550 w output impedance z out 750 e 1250 w response time (6) (10% to 90%) t r e 1.0 e ms warmup time (7) e e 20 e ms offset stability (8) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may induce addit ional error due to device selfheating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? tcr: z in deviation with minimum rated pressure applied, over the temperature range of 4 40 c to +125 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. warmup time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data temperature compensation figure 2 shows the typical output characteristics of the mpx10 and mpxv10gc series over temperature. because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differ- ences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. however, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the mpx2010d series sensor. several approaches to external temperature compensa- tion over both 40 to +125 c and 0 to +80 c ranges are presented in motorola applications note an840. linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range (figure 3). there are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. while a least squares fit gives the abest caseo linearity error (lower numerical value), the cal- culations required are burdensome. conversely, an end point fit will give the aworst caseo error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. output versus pressure differential figure 3. linearity specification comparison figure 4. unibody package e crosssectional diagram (not to scale) % ! !& ) $ ! $ %& %% %& & !($ "!*+ % $&( ! " " !%& ( ! !'&"'&0(.- * " !" %" ( %% "$%%'$ /" &' & !$& $ &+ "$%%'$ $ & !'&"'&0(.- "% /", %" $ &+" !%& &+" ( % (.- " " 4 4 4 figure 4 illustrates the differential or gauge configuration in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpx10 and mpxv10gc series pressure sensor oper- ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. me- dia other than dry air may have adverse effects on sensor per- formance and long term reliability. contact the factory for information regarding media compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the motorola pres- sure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier MPX10D 344 stainless steel cap MPX10Dp 344c side with part marking mpx10gp 344b side with port attached mpx10gs 344e side with port attached mpxv10gc6u 482a side with part marking mpxv10gc7u 482c side with part marking ordering information e unibody package mpx10 series pressure sensors are available in differential and gauge configurations. devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. mpx series device type options case type order number device marking basic element differential case 344 MPX10D MPX10D ported elements differential case 344c MPX10Dp MPX10Dp oed e e s gauge case 344b mpx10gp mpx10gp gauge case 344e mpx10gs MPX10D ordering information e small outline package (mpxv10gc series) device type/order no packing options case type device marking device type/order no. packing options case type device marking mpxv10gc6u rails case 482a mpxv10g mpxv10gc6t1 tape and reel case 482a mpxv10g mpxv10gc7u rails case 482c mpxv10g f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data unibody package dimensions case 34415 issue z %&+ " $!' !'&"'& %'"" + !'&"'& %&+ " ( %'"" + %'"" + $!' & pin 1 r n l g f d 4 pl t c m j b a % % ! ! !&% % ! &! $ "$ % + ! &$! % ! % ! % '% ( ! & ! %&!" $ ! %&!" $ !& &! * %&+ " (!'& (% (!'& dambar trim zone: f this is included within dim. afo 8 pl y z case 344b01 issue b %&+ " $!' !'&"'& %'"" + !'&"'& b n r c j t d f u h l port #1 positive pressure pin 1 a q s k g 4 pl p % # & % % # % & !&% % ! &! $ "$ % + ! &$! % ! % % % % (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data unibody package dimensions e continued case 344c01 issue b %&+ " $!' !'&"'& %'"" + !'&"'& port #2 port #1 port #2 vacuum k s w h l u f g d port #1 positive pressure q pin 1 4 pl p t t % # & % % # % & b n j c v r !&% % ! &! $ "$ % + ! &$! % ! % % % % a (p2) (p1) case 344e01 issue b %&+ " $!' !'&"'& %'"" + !'&"'& s !&% % ! &! $ "$ % + ! &$! % ! % % back side vacuum pin 1 4 pl port #1 positive pressure k a g f d & c n r v j b t (p1) (p2) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data small outline package dimensions case 482a01 issue a % % !&% % ! &! $ "$ % + ! &$! % ! % ! ! !& ' ! "$!&$'% ! * ' ! "$!&$'% ! ($& %'$% &+" $& s d g 8 pl % % & a b c m j k pin 1 identifier h t n v w case 482c03 issue b % % !&% % ! &! $ "$ % + ! &$! % ! % ! ! !& ' ! "$!&$'% ! * ' ! "$!&$'% ! ($& %'$% &+" $& % ! % &! &$ ! ) !$ "$ pin 1 k t s g a b c n v w m j identifier d 8 pl % % & detail x detail x f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motor ola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other ap plications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized app lication, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or dea th associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa/europe/locations not listed : motorola literature distribution; japan : motorola japan ltd.; sps, technical information center, 3201, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 technical information center: 18005216274 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2, dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 home page : http://www.motorola.com/semiconductors/ mpx10/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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